TOP / NEWS / 232. R Guo, B Xu, F Mu, J Shiomi, „Enhancing and mapping thermal boundary conductance across bonded Si-SiC interface", Applied Surface Science 682, 161724 (2025). [https://doi.org/10.1016/j.apsusc.2024.161724]

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TOP / NEWS / 232. R Guo, B Xu, F Mu, J Shiomi, „Enhancing and mapping thermal boundary conductance across bonded Si-SiC interface", Applied Surface Science 682, 161724 (2025). [https://doi.org/10.1016/j.apsusc.2024.161724]

232. R Guo, B Xu, F Mu, J Shiomi, „Enhancing and mapping thermal boundary conductance across bonded Si-SiC interface", Applied Surface Science 682, 161724 (2025). [https://doi.org/10.1016/j.apsusc.2024.161724]2025.04.11 Fri

R Guo, B Xu, F Mu, J Shiomi, „Enhancing and mapping thermal boundary conductance across bonded Si-SiC interface", Applied Surface Science 682, 161724 (2025). [https://doi.org/10.1016/j.apsusc.2024.161724]

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